| Signal integrity and controlled impedance news |
Trade in your Si6000 or CITS25 for an attractive discount on a 2010 edition of Si8000m, Si9000e, Speedstack or Speedflex. Interested? (Offer ends March 31st)
This application note demonstrates Speedstack's versatility, using the Speedflex Navigator to document a stackup where the board includes areas that are coated with photoresist and surface traces that remain exposed.
A professional tool for creating and and documenting flex-rigid PCB layer stackups, Speedflex for Speedstack is equally powerful at documenting sequential lamination/HDI. (Powerpoint 1Mb)
Version 10.02 contains a number of bugfixes and stability enhancements reported on the initial Speedflex 10.01 release. All Polarcare users of Speedstack or Speedflex 10.01 are recommended to move up to version 10.02 as soon as possible. (polarcare@polarinstruments.com)
2010 sees innovative new features and enhancements in Polar's PCB controlled impedance, PCB stackup and PCB signal integrity product line. Details in this Powerpoint presentation.
Rick Hartley interviews Ken Taylor at DesignCon 2010, find out the latest developments at Polar in this brief video interview, along with an update on measurement and modeling of lossy transmission lines (here)
International language packs reflecting the new features and enhancements to the 2010 editions of the Si8000 and Si9000 are available for download from the Polar web site. Contact Polarcare with your Polarcare contract number for download information (polarcare@polarinstruments.com)
Customer feedback on the initial release has resulted in major improvements to the Speedstack Coupon Generator user interface. Interface changes mean coupon dimensions now change dynamically, and users can see their adjustments in real time through the use of new "scrubber" controls. Speedstack Coupon generator is also now capable of working with Speedflex.
Mostly beneath the surface changes to Speedstack, primarily to support Speedflex optional Flexrigid capability, and also some underlying changes to the file format to support a future planned stackup search facility.
Si9000e - 2010 adds the capability to import Touchstone(TM) data so that users can compare measured and modeled S-parameter data. Plus the ability to set the solver into enhanced accuracy mode which is useful where you are working with thin copper layers.
Si8000m adds improved graphing capability, plus the ability to track W1/W2 trace width when adjusting trace size. A number of underlying bugfixes are also applied to the BEM solver engine.
Flexrigid PCB stackup design and documentation is now available for Speedstack PCB and Speedstack Si. this new option extends the design and documentation capability of Speedstack for Rigidflex PCB designers and fabricators. (more)
2010 editions of Speedstack, Si8000m, Si9000e, Speedstack Coupon generator are now shipping, and available on request to customers with active Polarcare contracts .
Polar's longest serving distributor - Daniel Corvaisier of Equitest in France has decided its time to take life easy and retire after over 24 years of representing Polar in France. All the Polar team wish Daniel a long and healthy retirement. Polar Instruments Europe Ltd will provide direct factory sales service and support for our French customers.
To simplify website navigation a products page is now available containing a simple list and link to popular Polar product pages more.
This new application note explains how to use the Si9000e to select the best price / performance of PCB laminates used in ultra high speed digital applications.
2010 editions of Polar software will be tested for Windows 7 compatibility. Speedflex and Speedstack are slated for January release along with Si8000m and Si9000e, Speedstack Coupon Generator 2010 is set for release during the first half of 2010. An active Polarcare contract entitles customers to a free of charge update on release. Please contact your local Polar sales office for information on other products and Windows 7 compatibility.
Polar's longest serving distributor - Daniel Corvaisier of Equitest in France has decided its time to take life easy and retire after over 24 years of representing Polar in France. All the Polar team wish Daniel a long and healthy retirement. From January 2010 Polar Instruments Europe Ltd will provide direct factory sales service and support for our French customers.
(Advance information)
New Speedflex Flexrigid option adds rigid-flex capability to Speedstack :
Speedflex adds flexrigid stackup design and documentation capability to Speedstack PCB and Speedstack Si. Set for January 2010 release, preview versions will be on show at Productronica Munich November 10th - 13th: Polar stands A1.545 and B2.549 (more)
New application note for PCB designers:
Application note 521 is an introductory guide to PCB manufacturing tolerances for PCB designers (more)
Enhanced protection for your precision measurement system:
Polarcare Protect for CITS900s is an extended warranty package for CITS900s that offers enhanced protection during the standard warranty period and ongoing protection throughout the operational life of the CITS900s. Polarcare Protect is a cost-effective alternative to the unplanned cost of accidental damage to the TDR front-end or precision microwave relay. (more)
How to avoid 2010 price increases on some IP probes:
Jan 1st 2010 sees significant price rises on many Polar IP series probes. However the 6 highest volume selling IP probes will remain at existing prices. To help minimize the effect of this price change there is a 50% discount offer on the Speedstack Coupon generator both annual and full licenses until 31st December 2009 .
Missed the live webinar? Now listen to the full version online:
Nearly 300 people attended Dr. Eric Bogatin's live Stackup design for differential pairs webinar. Between now and November 15th 2009 you can enjoy the recording - including an interesting Q&A session in full. From Nov 15th on a subscription will be required. Simply register on the www.bethesignal.com site and once you have completed free registration - you can view the webinar from here.
Now you can assist other prospective Si8000 / Si9000 and Speedstack users by submitting a brief review of the product. Our web team are happy to receive reviews of what's good, what's not so good and where you find the product useful. Reviews will be uploaded onto the website on a monthly basis.
A number of key changes made in CITS900s version 9_03 and above are field proven to increase product reliability - in particular with regard to the occasional loss of electronic serial number. All CITS900s customers regardless of PolarCare cover should update to 9_03 or higher. This is a free of charge update and must be installed to ensure standard warranty cover.
Webinar sponsored by Polar Instruments and presented by Dr. Eric Bogatin
When? Sept 16 (Wed), 1 PM Eastern time. Register now
Which is better loosely coupled or tightly coupled differential pairs? Will the location of the top and bottom planes in a stack up really affect the differential impedance? How do I achieve a 100 Ohm differential impedance in stripline? What about 85 Ohms? Why do I care? What will affect the losses in the line? How much is too much? If you struggle with any of these questions and want to learn about how the physical design of differential pairs affects the performance of the interconnect this free webinar is for you.
Si8000m and Si9000e. Version 9_07 adds the capability to rename impedance structures with your own in house naming conventions. The renamed structures are kept in a group called MyStructures. In addition Si9000e also gains the ability to add loss budget limit lines on the appropriate graph. Click for some sample screenshots....
Zuken and Polar are delighted to announce the ability to link DFM Center with Speedstack to assist in improved communication of PCB buildup between design and fabrication.
Q: Why
are the first and last impedance readings on the graph on slide 7 of
AP8171 different values? A: The solution
is included in a revised version of AP8171 found here:
1st Prize: 3 month Si9000e licence: Ian Kilburn - Dyconex AG
Runner up: 1 month Si9000e licence: Radu Alexiu - Conex Electronic
Runner up: 1 month Si9000e licence: Alex Novickis - Apcon, Inc.
This
Powerpoint note (AP8171)
showcases the Sensitivity Analysis feature of the Si8000m and Si9000e,
illustrating how multiple parameter variations may be charted to provide
instant detection of trends that are not easy to discover from a single
result.. (more...)
* See competition below...
ENDED 30th June 2009
We are giving away a 3 month Si9000e license
to the first person drawn at random on June 30th to correctly answer
the following question: Why are the first and last impedance readings
on the graph on slide 7 of AP8171 different values?
(Email your answer
here)
Understand finished dimensions in this new brief Powerpoint application note - of interest both to Speedstack customers and anyone wanting a better understanding of PCB finished dimensions. (more...)
ENDED 30th June 2009
20% discount offer on the next 10 Speedstack / Speedstack PCB / Speedstack Si licences. Offer expires June 30th 2009 (more...)
Speedstack 9.04 is now fully released, including new controlled impedance results tab, color coded pass/fail structure navigation and ability to switch layer types without re entering structures. The autostack engine is also enhanced. Upgrades from PolarCare email this link for new inquires.
Please note from 08 May 2009 Polar Instruments, Inc. has a new address - telephone numbers unchanged.
Fixes a problem where if the plane above the BOTTOM LAYER is assigned a NEGATIVE polarity not all the data is visible when the gerber is loaded in. Once installed the product version should be: 9.4.3400.15582. Upgrades from PolarCare
Speedstack 9.04 is days away from release, including new controlled impedance results tab, color coded pass/fail structure navigation and ability to switch layer types without re entering structures.
Polar's engineering team are pleased to announce an easy to use impedance coupon generator. For details please follow this link:
Rick and Ken discuss Si9000 and Speedstack at IPC Expo 2009.
3d
graphing in the Si8000 and Si9000e is now shipping in version number
9_04.
To see an animated preview - click the following link.
(requires Flash and takes a few moments to load)
Improved
system restore facility for CITS900s in version 9.03
contact: polarcare@polarinstruments.com
Improved Touchstone® export from Si9000e 2009 edition is described in this brief new application note:
Speedstack
2009 and Ucam PCB cam software, now link to speed and simplify the stackup
design process in the front end department.
For Ucam information please visit: www.ucamco.com
PCB
fabrication considerations for lossy lines is a new introductory note
- written primarily for fabricators, it is also of interest to
designers who are new to the topic.
For customers with PolarCare support contracts - a more detailed version
of this note is available from PolarCare
"An
S-Parameter Calibration Analysis of Polar Instruments Si9000"
In the note you will discover Eric's insights on comparing measured
and modelled results using a field solver, along with a variety of comparisons
of both field solved and measured s-parameter data. All this accompanied
by Eric's renowned insights on the interrelationship between measured
and modeled results.
Free condensed version is available here (you will need to register
with bethesignal.com before downloading) it is under the Si Insights
Jan 2009 heading:
Full version by subscription from www.bethesignal.com
or free for PolarCare customers.
Calc
engine low frequency support
S parameter - vary source and termination impedance
S parameter - enhanced graphing
Mixed mode s parameters
Via stub check
This application note outlines new features in Speedstack 2009
This application note explains how designers, PCB procurement specialists, PCB field application engineers and front end teams can benefit from clear communication of stackup.
This application note explains how to minimise the effect of vias - especially unconnected via stubs through the new Via stub check in the Si9000e.
1 Mania UCAM .Job Import
2 Printing - Impedance table columns now customisable
3 Symmetrical Delete
4 Symmetrical Add Drill
5 Symmetrical Move Material
6 Convert 2 Foils to a Core on import
7 Printing - New data column 'Processed Thickness'
8 Printing - 'Trace 1 In Layer' renamed to 'Impedance Signal Layer'
9 Printing - Thickness data can now toggle between Actual and Target
10 Printing - New-look Laser drills
Application note introducing forward and reverse crosstalk
Application note explaining the advantages of Si8000m multiple dielectric boundary element field solver over the Green's function / method of moments Si6000. Plus an explanation of the enhanced coating modeling on theSi8000m
Application note and updated Si9000e version 9.01 now supports modeling of high frequency losses owing to copper roughness.
Application note explaining how the stack "remake" capability of Speedstack simplifies the task of material allocation in PCB layer stackups.