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| Feature | Si6000 | Si8000m | Comments | ||||||||||||
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Field solver type |
Method of Moments & Green's Function
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Boundary Element BEM
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Both are industry proven methods, providing consistent and comparable results
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Number of trace configurations
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39 | 90+ |
Additional configurations in Si8000 allow accurate modeling of structures with local variations in dielectric constants
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Support multiple dielectric material layers
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No | Yes |
Accurately model layers of different dielectric materials |
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Support for single Dk materials
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Yes | Yes |
Easy to use for simple constructions |
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Support for resin-rich zones
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No | Yes | Accurately
model glass-depleted zones between differential tracks due to resin squeeze-out |
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Support for variable coating thickness
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No | Yes | Account
for different coating thickness over tracks, substrates and between differential pairs |
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Activation types
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Dongle
only (hardware key) |
Dongle,
node locked e-file, floating/server: (Plus annual and quarterly licenses) |
Flexible
licensing to suit your requirements. |
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Extended interface: "Quick Solver" |
No | Yes | See
the effect of process tolerance at a glance |
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Compatible with SB200 stackup builder
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No | Yes | Incorporates
stackup and controlled impedance data in a single file |
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Future development
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Development complete | Yes | Will interface with SB200 layer stack up design system and planned future modules. | ||||||||||||
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