Si6000 vs Si8000m Comparison

 
Feature   CITS25  Si6000 Si8000m  Comments

Field solver type

 
Method of Moments
& Green's Function
Boundary Element 
BEM
Both are industry 
proven methods, 
providing consistent
and comparable 
results
Number of trace 
configurations

 

12 39 100+
Additional configurations 
in Si8000 allow accurate 
modelling of structures 
with local variations 
in dielectric constants
Support multiple
dielectric material 
layers

 

No No Yes
Accurately model layers 
of different dielectric
materials
Support for single
Dk materials
Yes Yes Yes
Easy to use for simple
constructions
Support for 
resin-rich zones
No No Yes Accurately model glass-depleted zones between differential tracks due to resin squeeze-out
Support for variable 
coating thickness
No No Yes Account for different coating thickness over tracks, substrates and between differential pairs
Activation types
  Dongle only
(hardware key)
Dongle, node locked e-file, floating/server:
(Plus annual and 
quarterly licenses)
Flexible licensing to suit your requirements.
Extended interface:
"Quick Solver"
No No Yes See the effect of process 
tolerance at a glance
Compatible with Polar
Speedstack stackup 
builder
No No Yes Incorporates stackup and 
controlled impedance data in a single file
Multi-language support No No Yes English, German, Japanese, Simplified Chinese, Traditional Chinese, Korean languages supported
On-line help No No Yes Continually updated online help system
Spreadsheet modelling and goal-seeking No Yes Yes Wide range of advanced functions, e.g. sensitivity analysis; graphical presentation of the effects of parameter value changes
Support for coplanar structures No Yes Yes

Wide range of Coplanar structures modelled;  (with the advantage of single-sided construction  and showing only minor dispersion effects coplanar configuration is ideally suited for surface mounted devices.)

Calculates for local variations in dielectric constant No No Yes Si8000 takes into account the local variations in dielectric constant on close spaced differential structures (e.g. areas of high resin concentration between differential pairs).
Surface coating modelling No No Yes Si8000 models the solder resist thickness adjacent to, above and between surface traces
Constant Pitch goal seeking No No Yes S1 parameter adjusted automatically as W1 / W2 trace widths changes to maintain trace separation.
Sensitivity Analysis No No Yes Calculate and plot impedance against a specified structure parameter

G
raph constant impedance vs changing X / Y axis parameters
Odd, even impedance modelling No   Yes  
Dual coated structures No No Yes  
Future development
Development complete Development complete Yes Interfaces with Speedstack layer stack up design system and planned future modules.