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Enhanced
modelling of solder mask coatings with the Si8000m
Application Note 176
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You probably already know that it is harder
to achieve a tight tolerance for impedance controlled tracks on outer
layers.
These screen shots demonstrate how the modelling on the Polar Si8000 offers a significant enhancement over the Si6000 when trying to predict the finished impedance of surface microstrips. Si6000 and Si8000m coated microstrip models The following series of pictures shows the differences between the modelling employed on the Si6000 and the Si8000m. |
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Si8000m Coated Microstrip model — note how the boundary element field solver takes into account the profile of the solder mask: |
Si6000 Coated Microstrip model |
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Enhanced calculation with the Si8000m
Now compare the two predictions for a 75 Ohm trace: |
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Si8000m enhanced model |
The Si6000 calculates 2.4 Ohms low compared with the more accurate model in the Si8000m |
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Modelling the production process window Finally, you can also use the Extended Interface Style of the Si8000m to display a process window, and at a glance see how production process may influence your production yield. Selecting the Extended Interface Style displays additional fields, Tolerance, Minimum and Maximum so you can specify a range of values for each parameter and observe the effect of manufacturing process variations.
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Fields
which control the maximum impedance value are shown in green, fields
which control the minimum impedance value are shown in orange. In the example
above the minimum values of trace width, W1 and W2 (shown in
green) control the maximum value of impedance.
Note the variation in impedance for ± 0.5 mil of etch variation. |
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| © Polar Instruments 2008. Polar Instruments pursues a policy of continuous improvement. The specifications in this document may therefore be changed without notice. All trademarks recognised. |