Speedstack PCB
Speedstack PCB – Impedance field solver / PCB stackup


For flex-rigid and HDI stackups – also see Speedflex
  Create and professionally document layer stackups in an instant
Speedstack brochure screen / print(4MB) Speedstack Zuken link screen / print
Request a Speedstack evaluation Speedstack Ucamco link brochure
Speedstack PCB customers Polarcare support: screen / print
Speedstack PCB reviews Add a review
Material libraries for Speedstack are available exclusively for Polarcare customers from Polar's supplier partners listed in the Polar Materials Partner program
Speedstack PCB – Impedance field solver and layer stackup package

Speedstack PCB is a packaged combination of the Si8000 field solving impedance calculator and the Speedstack professional layer stackup design system. If you need both impedance calculation and layer stackup/build up documentation the Speedstack PCB offers a considerable saving over purchasing separate licenses.
Zuken DFM Center - Polar Speedstack link

The Zuken DFM Center PCB manufacturing pre-processing and CAM system integrates directly with Polar Instruments’ Speedstack PCB system, ensuring high final product quality, consistency of documentation, reduced costs and shorter time-to market whilst reducing the possibility of errors. 		Zuken
DFM Center

Ucamco UCAM - Polar Speedstack link


Ucamco's UCAM software links directly with Polar's Speedstack Stackup Builder. Using a single material database, customers realise significant cost savings from faster job processing and fewer errors. 		Ucamco
Software  

IPC Apex – Rick Hartley interviews Polar's Martyn Gaudion

Managing layer stackup across the supply chain with Polar's Speedstack

High-speed design consultant Rick Hartley interviews Polar Instruments' Martyn Gaudion at IPC Apex on the subject of Managing layer stackup across the supply chain using Speedstack.

Speedstack PCB is ideal for you if:

 You need to calculate impedance requirements on multilayer boards with multiple controlled impedance structures per stack. You need to make changes to the stack - for example substitute material in the case of a shortage, and rapidly check (for example) overall height, line width and transmission line impedance values.  By employing the link between the Si8000 field solver and  Speedstack  you can recalculate all the impedance values in a single pass in a fraction of the time taken traditionally.  

For more information on Speedstack layer stackup design click here:

 With a range of license packages to suit your budget – which license is best for me? 

 
Clear stackup documentation
Click to enlarge 		Clear concise documentation Share and document stackup information in a clear and consistent format. Material usage and graphical stack up views can be printed or shared electronically in a format that is easily read by both interconnect designer and fabricator. 
Design rule checks
 Click to enlarge 		Design rules check: Real time design rule check highlights, material mismatch, copper imbalance, RCC foils on inner layers and other design parameters. 
Share material information
Click to enlarge 		Your materials:

 PCB fabricators can build a library of commonly used materials and materials that are normally available from stock along with cost or performance information. Speedstack PCB allows you to direct import your materials library in text delimited form. This information may be shared with interconnect designers. This means that designers can at a glance choose materials on a basis of cost / lead time / or performance.
System requirements
For PC system requirements for Speedstack PCB see AP605