| Speedstack Si – PCB stackup and transmission line design |
For flex-rigid and HDI stackups – also see Speedstack Flex and Speedstack HDI
Speedstack Si – lossy line field solver and layer stackup design
Polarcare brochure
Speedstack Si
Speedstack Si is a packaged combination of the Si9000 field solving PCB Transmission Line Design System and Speedstack professional Layer Stackup Design software. If you need both powerful and accurate field solvers to predict your printed circuit board performance and layer stackup / buildup documentation the Speedstack Si offers a considerable saving over purchasing separate licences.
IPC Apex – Rick Hartley interviews Polar's Martyn Gaudion
High-speed design consultant Rick Hartley interviews Polar Instruments' Martyn Gaudion at IPC Apex on the subject of Managing layer stackup across the supply chain using Speedstack.
Speedstack Si is ideal for you if:
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You need to calculate impedance requirements and model loss on multilayer boards with multiple controlled impedance structures per stack.
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You need to extract engineering information to drive simulation software prior to committing a design into production.
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You need to experiment with differing stack up approaches – for example, you can substitute material because of a shortage and rapidly check the new overall height, line width and transmission line impedance values. By employing the link between the Si9000e transmission line design system and Speedstack software you can recalculate all the impedance values in a single pass in a fraction of the time taken traditionally.
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You need to alter line widths and rapidly communicate the new build information electronically.