Polar News

This Powerpoint note (AP8171) showcases the Sensitivity Analysis feature of the Si8000m and Si9000e, illustrating how multiple parameter variations may be charted to provide instant detection of trends that are not easy to discover from a single result.. (more...) 

* See competition below...

We are giving away a 3 month Si9000e license to the first person drawn at random on June 30th to correctly answer the following question: Why are the first and last impedance readings on the graph on slide 7 of AP8171 different values?
(Email your answer here)

Understand finished dimensions in this new brief Powerpoint application note - of interest both to Speedstack customers and anyone wanting a better understanding of PCB finished dimensions. (more...)

20% discount offer on the next 10 Speedstack / Speedstack PCB / Speedstack Si licences. Offer expires June 30th 2009 (more...)

Speedstack 9.04 is now fully released, including new controlled impedance results tab, color coded pass/fail structure navigation and ability to switch layer types without re entering structures. The autostack engine is also enhanced. Upgrades from PolarCare email this link for new inquires.

Please note from 08 May 2009 Polar Instruments, Inc. has a new address - telephone numbers unchanged.

Fixes a problem where if the plane above the BOTTOM LAYER is assigned a NEGATIVE polarity not all the data is visible when the gerber is loaded in. Once installed the product version should be: 9.4.3400.15582. Upgrades from PolarCare

Speedstack 9.04 is days away from release, including new controlled impedance results tab, color coded pass/fail structure navigation and ability to switch layer types without re entering structures. 

Polar's engineering team are pleased to announce an easy to use impedance coupon generator. For details please follow this link:

Rick and Ken discuss Si9000 and Speedstack at IPC Expo 2009.

3d graphing in the Si8000 and Si9000e is now shipping in version number  9_04.
To see an animated preview - click the following link.
(requires Flash and takes a few moments to load)

Improved system restore facility for CITS900s in version 9.03 
contact: polarcare@polarinstruments.com

Improved Touchstone® export from Si9000e 2009 edition is described in this brief new application note:

Speedstack 2009 and Ucam PCB cam software, now link to speed and simplify the stackup design process in the front end department.

For Ucam information please visit: www.ucamco.com

PCB fabrication considerations for lossy lines is a new introductory note -  written primarily for fabricators, it is also of interest to designers who are new to the topic.

For customers with PolarCare support contracts - a more detailed version of this note is available from PolarCare

"An S-Parameter Calibration Analysis of Polar Instruments Si9000"

In the note you will discover Eric's insights on comparing measured and modelled results using a field solver, along with a variety of comparisons of both field solved and measured s-parameter data. All this accompanied by Eric's renowned insights on the interrelationship between measured and modeled results.

Free condensed version is available here (you will need to register with bethesignal.com before downloading) it is under the Si Insights Jan 2009 heading:

Full version by subscription from www.bethesignal.com or free for PolarCare customers.

Calc engine low frequency support
S parameter - vary source and termination impedance
S parameter - enhanced graphing 
Mixed mode s parameters
Via stub check 

This application note outlines new features in Speedstack 2009

This application note explains how designers, PCB procurement specialists, PCB field application engineers and front end teams can benefit from clear communication of stackup.

This application note explains how to minimise the effect of vias - especially unconnected via stubs through the new Via stub check in the Si9000e.

1 Mania UCAM .Job Import
2 Printing - Impedance table columns now customisable
3 Symmetrical Delete
4 Symmetrical Add Drill
5 Symmetrical Move Material
6 Convert 2 Foils to a Core on import
7 Printing - New data column 'Processed Thickness'
8 Printing - 'Trace 1 In Layer' renamed to 'Impedance Signal Layer'
9 Printing - Thickness data can now toggle between Actual and Target
10 Printing - New-look Laser drills

Application note introducing forward and reverse crosstalk 

Application note explaining the advantages of Si8000m multiple dielectric boundary element field solver over the Green's function / method of moments Si6000. Plus an explanation of the enhanced coating modeling on theSi8000m

Application note and updated Si9000e version 9.01 now supports modeling of high frequency losses owing to copper roughness. 

Application note explaining how the stack "remake" capability of Speedstack simplifies the task of material allocation in PCB layer stackups.